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Special Economic Measures (Russia) Regulations (SOR/2014-58)

Regulations are current to 2024-06-19 and last amended on 2024-06-13. Previous Versions

SCHEDULE 5.1(Subsections 3.06(1) and (2))Goods and Technologies

  • Interpretation

    1 In this Schedule, development, electronic assembly, energetic material, production, required, software and use have the same meaning as under the heading “Definitions of Terms Used in Groups 1 And 2” of A Guide to Canada’s Export Control List, published by the Department of Foreign Affairs, Trade and Development, as amended from time to time.

  • Non-application

    2 This Schedule does not apply to goods or technologies that are subject to export control under the Export Control List, unless the good or technology is described in item 5400 of Group 5 of the schedule to that List.

Goods and Technologies

Column 1
ItemGoods and Technologies
1Equipment, electronic assemblies and components, specially designed for quantum computersFootnote for Goods and Technologies1, quantum electronics, quantum sensors, quantum processing units, qubit circuits, qubit devicesFootnote for Goods and Technologies2 or quantum radar systems.

Cryogenic refrigeration systemsFootnote for Goods and Technologies3 designed to maintain temperatures below 1.1 kelvin for 48 hours or more and cryogenic refrigeration equipment and components therefor, as follows:

  • (a) pulse tubes;

  • (b) cryostats;

  • (c) dewars;

  • (d) gas handling systems;

  • (e) compressors; and

  • (f) control units.


Ultra-high vacuum (UHV)Footnote for Goods and Technologies4 equipment, as follows:

  • (a) UHV sublimation, turbomolecular, diffusion, cryogenic, or ion-getter pumps; and

  • (b) UHV pressure gauges.

4High quantum efficiency photodetectors with a quantum efficiency greater than 80% in the wavelength range exceeding 300 nanometres but not exceeding 1700 nanometres.

Manufacturing equipment, as follows:

  • (a) additive manufacturing equipment for the production of metal parts, as follows:

    • (i) powder-bed systems using selective laser melting, laser cladding, direct metal laser sintering or electron beam melting, or

    • (ii) powder-fed systems using laser cladding, direct energy deposition or laser metal deposition;

  • (b) additive manufacturing equipment for energetic materials, including equipment using ultrasonic extrusion; and

  • (c) vat photopolymerization additive manufacturing equipment using stereo lithography or direct light processing.

6Metal powders and metal alloy powders usable for the additive manufacturing equipment referred to in Item 5(a).

Microscopes, related equipment and detectors, as follows:

  • (a) scanning electron microscopes;

  • (b) scanning auger microscopes;

  • (c) transmission electron microscopes;

  • (d) atomic force microscopes;

  • (e) scanning force microscopes; and

  • (f) equipment and detectors specially designed for use with the microscopes referred to in paragraphs (a) to (e), employing any of the following:

    • (i) x-ray photo spectroscopy,

    • (ii) energy-dispersive x-ray spectroscopy,

    • (iii) electron back scatter detector systems, or

    • (iv) electron spectroscopy for chemical analysis.

8DecapsulationFootnote for Goods and Technologies5 equipment for semiconductor devices.
9Software specially designed or modified for the development, production or use of the systems, equipment and components referred to in Items 1 to 8.
10Software for digital twins of additive manufactured products or for the determination of the reliability of additive manufactured products.
11Technology required for the development, production or use of the systems, equipment, components or software referred to in Items 1 to 10.
  • Return to footnote 1Quantum computers perform computations that harness the collective properties of quantum states, such as superposition, interference and entanglement.

  • Return to footnote 2The units, circuits and devices referred to in this Item include those that use or are based on superconducting circuits, quantum annealing, ion traps, photonic interaction, silicon spin qubits and cold atoms.

  • Return to footnote 3Cryogenic refrigeration systems include dilution refrigeration systems, adiabatic demagnetization refrigerators and laser cooling systems.

  • Return to footnote 4UHV means 100 nanoPascals (nPa) or lower.

  • Return to footnote 5Decapsulation means the removal of a cap, lid, or encapsulating material from a packaged integrated circuit by mechanical, thermal or chemical methods.


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